GLOBALFOUNDRIES Principal Technology & Integration Engineer (m/f) Device - Digital Performance in Dresden, Germany

Shaping the future with innovation and smart technologies .... our growth offers development opportunities for your career

We are Europe’s largest semiconductor manufacturing location, combining smart solutions with leading edge technologies in our Dresden Foundry - for our customers, for groundbreaking products and for a sustainable future. In addition to our existing manufacturing of 28nm semiconductor products, our new 22nm technology (22FDX) sets standards with regard to energy efficiency and performance. With our energy saving technology, we are targeting the growth markets of the future: the 'Internet of Things', including areas such as Industry 4.0, Wearables and Automotive. With the development of our next technology generation (12FDX), we want to continue this path consistently.

Principal Technology & Integration Engineer (m/f) Device - Digital Performance

We are looking for experienced Device / Transistor Engineers (m/f) to support our development activities in the Technology & Integration Department in Dresden / Germany. You will be a member of a highly-skilled team working on development of new and optimization of existing active and passive devices. The task of the team is to define, develop and implement device improvements in leading-edge CMOS technologies in agreement with customers’ needs.

Your specific responsibilities will be to:

  • develop new integration approaches in collaboration with Front-End of Line (FEoL) and Middle-of-Line (MoL) development teams

  • continuously improve device performance and power consumption in agreement with customer needs

  • design experiments dedicated to the continuous development of all devices (active/passive) for leading-edge CMOS technologies

  • analyze electrical characteristics of transistors & passive devices

  • Perform data analysis including AC and DC device performance analysis

  • define test structures and test conditions needed to analyze/understand specific phenomena that limit desired improvements

  • validate existing and define new design rules related to novel device structures and their fabrication

  • compare silicon results with Spice models, and design manual targets

  • transfer know-how from the R&D department to the production facility on site as well as to other international manufacturing sites

    Your Qualifications:

  • Degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant technical discipline is required.

  • You have at least 5 years of professional experience in the semiconductor industry and would like to make the next step in your career.

  • You are passionate about next-generation semiconductor technologies and seek for a challenging task in the field of device development.

  • Your extensive knowledge of transistor physics and fabrication allows you to make smart decisions to actively contribute to technology improvements in agreement with customers’ needs.

  • Preferably, you also have some experience in FD SOI, RF CMOS, ESD, TCAD, PDK, DOE, 8D process, PCRB, MRB, FMEA, project management and compact modeling of semiconductor devices.

  • We are looking for a team player with strong communication skills who is able to efficiently exchange ideas and share results within and between teams with different technical background.

  • We expect competence in both, written and spoken English as well as solid knowledge in use of standard office software (Excel/PowerPoint).

Organization: *FAB 1 INT DEVICE/WET-00085122

Title: Principal Technology & Integration Engineer (m/f) Device - Digital Performance

Location: Europe %26 Middle east Region-Germany-Saxony-Dresden-DE, Dresden

Requisition ID: 16002102