GLOBALFOUNDRIES Principal Engineer (m/f) - OPC - Design for Manufacturability DFM in Dresden, Germany

Shaping the future with innovation and smart technologies .... our growth offers development opportunities for your career

We are Europe’s largest semiconductor manufacturing location, combining smart solutions with leading edge technologies in our Dresden Foundry - for our customers, for groundbreaking products and for a sustainable future. In addition to our existing manufacturing of 28nm semiconductor products, our new 22nm technology (22FDX) sets standards with regard to energy efficiency and performance. With our energy saving technology, we are targeting the growth markets of the future: the 'Internet of Things', including areas such as Industry 4.0, Wearables and Automotive. With the development of our next technology generation (12FDX), we want to continue this path consistently.

  • ** Principal Engineer (m/f) - OPC - Design for Manufacturability (DFM) *

GLOBALFOUNDRIES is seeking a highly skilled and motivated OPC/DFM Engineer (m/f). The OPC/DFM Engineer will participate in the investigation, analysis, development and deployment of a wide range of OPC, Design for Manufacturability (DFM), and EDA algorithms solutions and tools as well as full-chip Design-to-Mask architecture and flows. As member of a global organization you will interface with both local (Fab1 Dresden) and global teams in the US and Asia. Your main task is to ensure readiness of OPC/Design Finishing solutions in alignment with the Fab1 testsite/shuttle and product tape-out schedule.


  • Owner of Site Process-Specific Design Finishing , Mask-Related RET Optimization & Verification (e.g. SRAF, litho target sizing/dose centering, mask type), OPC Recipe Definition and Code Implementation for new Layers using existing OPC & Litho Solutions.

  • OPC Representative in Yield and Module Development Meetings; Communication of OPC Recipe Experiments and Solutions to Site Engineering Teams.

  • Participate in the OPC/Design-Finishing requirements specification and validation/testing process working with OPC, FAB Integration and Yield Engineering.

  • Pro-actively discover and deploy opportunistic solutions to address systemic yield issues.

  • Coordinate with IP Design Teams, Design Enablement, Integration Engineering, Process Development, OPC Development, and Manufacturing around the world to define OPC/DFM flow requirements.

  • Develop and deploy advanced node Design Finishing flows and support integration of these flows into the overall tape-out process.

  • Tools development and deployment.

  • Support advanced OPC/DFM applications for Fab Yield Improvement.

    Required Qualifications:

  • BS/MS/PhD in Electrical Engineering/Computer Science/Chemistry/Materials Science, Mathematics or Physical Sciences. At least 2 years relevant experience in OPC software via semiconductor manufacturing or OPC Vendor.

  • Understanding of Semiconductor wafer manufacturing process, especially photolithography.

  • Understanding of the EDA (OPC & Design Finishing for Yield) linkage to semiconductor processes for IC manufacturing at advanced nodes (28nm and below).

  • Programming skills in two or more of the following:

    o High-level languages (e.g. C/C , Java, etc.)

    o Scripting languages: Tcl/TK, Perl and Python, etc.

  • Experience with DRC language such as Calibre SVRF / Synopsys ICV

  • Excellent technical communication and strong English skills.

  • International and/or domestic travel may be required.

Organization: *OPC DRESDEN-00084685

Title: Principal Engineer (m/f) - OPC - Design for Manufacturability DFM

Location: Europe %26 Middle east Region-Germany-Saxony-Dresden-DE, Dresden

Requisition ID: 16002137